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ANSYS Electronics Suite 2019 R3 €60 buy download

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ANSYS Electronics Suite 2019 R3 | 9.9 Gb
Updated: Added ANSYS Electronics MCAD Translators 2019 R3
ANSYS Inc. has announced the availability of the 2019 R3 edition of its ANSYS Electronics Suite of electronics and electromagnetics simulation software solutions.

What's New in ANSYS Electronics 2019 R3 General Electronics Desktop
- ANSYS Cloud support for HFSS, HFSS 3D Layout, Maxwell,and Q3D Extractor
- New Granta material library (optional, licensed feature) – Includes more than 700 generic materials and 500 producer-specific magneticmaterials
- Dynamic surface resolution–improved curved surface meshing (Beta)
- 3D Components “in-place” generation
- New 3D modeler face coordinate system for curved faces
HFSS
- New finite array DDM with 3D Component multi-cell hierarchy (Beta)
- SBR+ excitations from finite array DDM and driven terminal designs
- Mechanical Thermal two-way coupling in Electronics Desktop (Beta)
- New RadarPre and RadarPost ACT extensions with installation
- SBR+ Creeping Wave physics for radar signature modeling
- Near field export on plane/rectangular surface
- Spatially varying material properties via XYZ datasets
- Parametric current source antennas in SBR+ designs
- Single-surface multipaction on dielectric surfaces (Beta)
- Microstrip and generally dispersive wave ports for implicit transient solver
HFSS 3D Layout
- ECADXplorer, new workflow for large GDS layouts (Beta)
- HFSS-Icepak two-way multiphysics thermal coupling
- Physically connected selection filter with MCAD (forexample, connector) geometry
- SPICE netlist circuit element support
- Surface roughness can now be specified independently on the side and top/bottom surfaces of conductors
SIwave
- Ability to distribute HFSS regions and solve in parallel
- Improved Layer Stackup Wizard, including CPW and circuit support
- SYZ plotting enhancements including the ability to plot results from multiple datasets
- New distributed matrix solver for CPA
- CPA support for global temperature, unconnected PLOC nets supply voltages
- New distributed memory interpolating sweep for HFSS-PI
- Ability to disconnect unwanted net mappings in CPA
- Reuse extracted CPA model with different PLOC/CPM files
Maxwell
- Support for Litz wire modeling in transient solvers
- Improved expression cache efficiency for TDM in Maxwell 2D
- New RMxprt support for stepping motors
- New MPI-based sweep for Eddy, support for multi-level distribution
- Mechanical Thermal two-way coupling in Electronics Desktop (Beta)
Icepak
- Transient thermal solution ssupported as a new solution type (Beta)
- Combine EM losses from multiple frequencies solutions from HFSS
- Two-way coupling with 3D Layout designs for SIwave DC and HFSS solutions
- Part-by-part meshing for efficient simulation of conduction-only models (Beta)
- New mesh operations for local control on objects, faces, and edges
- Visualization of mapped losses from EMcoupling
- Ability to use correlation on Wall boundaries with HTC
- Continued expansion of capabilities converted from classic Icepak archives
Mechanical(Beta)
- Two-way thermal coupling with HFSS, Maxwell, and Q3D Extractor
- Ability to link mesh along with losses for thermal coupling
- New rotating fluid boundary to model heat transfer in electric machines
- New constant heat flux excitation
- Support for plotting of external thermal loads
Q3D Extractor
- Improved performance of multithreaded direct solver
- Mechanical Thermal two-way coupling in Electronics Desktop (Beta)
Circuit
- Improved default resolution of QuickEye and VerifEye plots
- Support for deconvolution for AMI with Init Only models
- Ability to bound calculated DFE tap weights according to HSSL standards
- Support for design datasets to import tabular data for use in reports
- New dynamic link dialog box to choose designs from all open projects
EMIT(Beta)
- Integration of RF Systems into a unified EMIT design schematic
- Improved workflow and usability

Twin Builder

Modelica Enhancements
- User can easily clone (copy) and remove the model using the Models context menu
- The editor now supports copy-paste of Modelica blocks
- Modelica model interfaces can be edited after compilation
- New, detailed HTML Modelica Compiler diagnostic report
- Modelica UI now shows existing instance modifications in Modelica Libraries
Twin Builder ROM
- Introducing new ANSYS Static ROM Builder
- Several improvements in Dynamic ROM Builder performance,UI and graphing capabilities
Solver and Simulation Enhancements
- Twin Builder now supports state saving (Import FMUs that supports serialization)
- Automatic copy of DLLs for C-models that are stored with the model to on a remote computer
Battery and Electrification Modeling
- Introducing new ECM Cell and Module Toolkit
- Battery ECM model library in Modelica now supports both lookup table (SOC and temperature) and equation-based model(SOC) models
- Battery ECM model library in Modelica now supports scaling capability and disabling extrapolation
- Average Device now supports internal and mixed modes
Twin Builder UI Enhancements
- New template in special component Wizard dialogs, fixing update issue
- Enhancements in Schematic Editor including modernized tabs, zoom-in, and scroll (holding shift key) from mouse wheel
- Model code (if available) can now beviewed in Edit Component dialog box (replacing Footprints)
- Now user use simulator model as variation in Parametric analysis
Rapid Prototyper Installer and Licensing
- Licensing and installation is streamlined for Rapid Prototyper
Note: For details on all new features and enhancements, refer to the WhatsNewInElectronics.pdf available from the Ansys.Electronics.2019R3.Win64.iso in this release.

ANSYS Electronics Desktop is a comprehensive platform that enables electrical engineers to design and simulate various electrical, electronic and electromagnetic components, devices and systems. It is a unified interface which creates and analyzes electromagnetic (EM), thermal and circuit designs.

Engineers can access gold-standard tools such as ANSYS HFSS, ANSYS Maxwell, ANSYS Q3D Extractor and ANSYS Icepak using electrical CAD (ECAD) and mechanical CAD (MCAD) workflows. In addition, the Electronics Desktop includes direct links to the full ANSYS portfolio of thermal, fluid and mechanical solvers for comprehensive multiphysics analyses.

Engineers can integrate rigorous 2D and 3D physics analyses with system and circuit simulations, all inside a single framework called ANSYS Electronics Desktop. Any combination of products within the Electronics Desktop can be inserted into a single project. For instance, you can combine disparate design types such as HFSS, Circuit and Icepak into a single project. Schematics can be used to wire up different field solver models and create a model of a high-level system through dynamic links that combine 3D EM and SPICE circuit analyses.

Engineers can efficiently manage complex projects that require several different analysis tools to predict the operation of their electronic products. Designs can also be parameterized. With Optimetrics, design variations can be studied and made available to other modules when the designs are included in a higher-level simulation. This allows engineers to conduct what-if experiments and study the effects of component design parameter variations on the behavior of the entire system.

This video introduces you to the ANSYS Electronics Desktop environment and its intuitive ribbon interface. This interface enables you to execute workflows for electromagnetic, thermal, and circuit analyses, as well as multiphysics simulations. The video demonstrates the advantages of using Electronics Desktop, such as its clear visual layout, consistent look and feel, and its user-friendly interface, which makes it easy to discover commands and work across multiple products. The video also provides a brief description of the commands on various tabs of the ribbon for the different products within the Electronics Desktop.


Founded in 1970, ANSYS employs nearly 3,000 professionals, many of whom are expert M.S. and Ph.D.-level engineers in finite element analysis, computational fluid dynamics, electronics, semiconductors, embedded software and design optimization. Our exceptional staff is passionate about pushing the limits of world-class simulation technology so our customers can turn their design concepts into successful, innovative products faster and at lower cost. As a measure of our success in attaining these goals, ANSYS has been recognized as one of the world's most innovative companies by prestigious publications such as Bloomberg Businessweek and FORTUNE magazines.

Product: ANSYS Electronics
Version: 2019 R3 Suite
Supported Architectures: x64
Website Home Page : www.ansys.com
Language: english
System Requirements: PC *
Supported Operating Systems: *
Size: 9.9 Gb

* System Requirements: ANSYS Electronics Suite R3 is supported on the following Windows platforms and operating system levels.

Processor: x64 (64-bit)
Operating System:
Windows 7 (Professional & Enterprise),
Windows 10 (Professional, Enterprise & Education)
Windows Server 2016 Standard
Windows Server 2019 Standard
Memory Requirements: You must have a minimum of 8GB of memory to run product installations; 16 or 32GB of memory is recommended.

ANSYS 2019 R3 - Platform Support by Application / Product

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ANSYS Electronics Suite 2019 R3
€60
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